Circuit board plate classification:

FR-1: Flame retardant copper clad phenolic paper laminate. IPC4101 detailed specification number 02; Tg N/A.

FR-4:

Flame-retardant copper clad epoxy E glass fiber cloth laminate and dao and its bonding sheet material. IPC4101 detailed specification number 21; Tg≥100℃;

Flame-retardant copper-clad modified or unmodified epoxy E glass fiber cloth laminate and its bonding sheet material. IPC4101 detailed specification number 24; Tg 150℃~200℃;

Flame-retardant copper clad epoxy/PPO glass cloth laminate and its bonding sheet material. IPC4101 detailed specification number 25; Tg 150℃~200℃;

Flame retardant copper-clad modified or unmodified epoxy glass cloth laminate and its bonding sheet material. IPC4101 detailed specification number 26; Tg 170℃~220℃;

Flame-retardant copper-clad epoxy E glass cloth laminate (used for catalytic addition method). IPC4101 detailed specification number 82; Tg N/A; 94vo-cem-1.

Distinguish between good and bad: those that meet the standards are good, and those that do not meet the specifications are bad. Main standards of substrate materials:

National standards: my country's national standards for substrate materials include GB/T4721-47221992 and GB4723-4725-1992. The copper clad laminate standard in Taiwan, China is the CNS standard, which is based on the Japanese JIs standard and was issued in 1983 . To

International standards: Japanese JIS standards, American ASTM, NEMA, MIL, IPc, ANSI, UL standards, British Bs standards, German DIN and VDE standards, French NFC and UTE standards, Canadian CSA standards, Australian AS Standards, FOCT standards of the former Soviet Union, international IEC standards, etc.