Process flow of PCB
Publisher: Administrator Date:2020-09-17
1. Cutting material
Purpose: According to the requirements of the engineering data MI, on the large sheets that meet the requirements, cut into small pieces to produce panels. Small sheets that meet customer requirements.
Process: large sheet → cutting board according to MI requirements → curium board → beer fillet \ edging → plate out
Second, drilling
Purpose: According to the engineering data (customer data), drill the required hole in the corresponding position on the sheet of the required size.
Process: stacked board pin → upper board → drilling → lower board → inspection \ repair
Three, sink copper
Purpose: Immersion copper is to deposit a thin layer of copper on the insulating hole wall by chemical method.
Process: rough grinding → hanging board → automatic copper sinking line → lower board → dip 1% dilute H2SO4 → thickened copper
Four, graphics transfer
Purpose: Graphic transfer is to transfer the image on the production film to the board
Process: (blue oil process): grinding plate → printing the first side → drying → printing the second side → drying → exploding → developing shadow → inspection; (dry film process): hemp board → pressing film → standing → right Position→Exposure→Standing→Development→Check
Five, graphic plating
Purpose: Pattern electroplating is to electroplate a copper layer with the required thickness and a gold-nickel or tin layer with the required thickness on the bare copper skin or hole wall of the circuit pattern.
Process: upper board → degreasing → washing twice → micro-etching → washing → pickling → copper plating → washing → pickling → tin plating → washing → lower board
Six, remove the film
Purpose: Use NaOH solution to remove the anti-electroplating coating film to expose the non-circuit copper layer.
Process: water film: insert rack → soak alkali → rinse → scrub → pass machine; dry film: put board → pass machine
Seven, etching
Purpose: Etching is to use a chemical reaction method to corrode the copper layer of non-circuit parts.
Eight, green oil
Purpose: The green oil is to transfer the graphic of the green film to the board to protect the circuit and prevent the tin on the circuit when welding parts.
Process: grinding plate→printing photosensitive green oil→curium plate→exposure→exposure; grinding plate→printing the first side→drying plate→printing the second side→drying plate
Nine, characters
Purpose: Characters are provided as a mark for easy identification
Process: After the green oil finishes → cool and stand → adjust the screen → print characters → rear curium
Ten, gold-plated fingers
Purpose: Plating a layer of nickel/gold with the required thickness on the finger of the plug to make it more hard and wear-resistant
Process: upper plate → degreasing → washing twice → micro-etching → washing twice → pickling → copper plating → washing → nickel plating → washing → gold plating
Ten 1 (a process in parallel), tin plate
Purpose: The tin spraying is to spray a layer of lead tin on the exposed copper surface that is not covered with solder mask to protect the copper surface from corrosion and oxidation to ensure good soldering performance.
Process: micro-erosion → air drying → preheating → rosin coating → solder coating → hot air leveling → air cooling → washing and air drying
11. Forming
Purpose: Organic gongs, beer boards, hand gongs, and hand-cutting methods to produce the shape required by the customer through die stamping or CNC gong machine.
Note: The accuracy of the data gong machine board and the beer board is high. The hand gong is second, and the minimum hand-cutting board can only be made with some simple shapes.
12. Test
Purpose: To pass electronic 100% testing to detect defects that affect functionality such as open circuits and short circuits that are not easy to find visually.
Process: upper mold → release board → test → qualified → FQC visual inspection → unqualified → repair → return test → OK → REJ → scrap
13. Final inspection
Purpose: To pass 100% visual inspection of the board's appearance defects, and to repair minor defects to avoid problems and defective boards from flowing out.
Specific work flow: incoming materials → view information → visual inspection → qualified → FQA spot check → qualified → packaging → unqualified → processing → inspection OK